• 专利标题:   Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.
  • 专利号:   DE102022204962-A1, WO2022243894-A1, US2022377907-A1
  • 发明人:   MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B
  • 专利权人:   UNIV BARILAN, MELLANOX TECHNOLOGIES LTD, UNIV BARILAN, MELLANOX TECHNOLOGIES LTD
  • 国际专利分类:   C01B032/182, H05K001/03, H05K003/22, H05K003/46, C23C016/04, G03F007/16, G03F007/20, H01L021/285, C01B032/188, H05K001/02
  • 专利详细信息:   DE102022204962-A1 24 Nov 2022 H05K-003/22 202201 Pages: 23 German
  • 申请详细信息:   DE102022204962-A1 DE10204962 18 May 2022
  • 优先权号:   US201910P, US305233

▎ 摘  要

NOVELTY - Repairing at least one layers of a laminate stack or a printed circuit board (PCB), comprises (a) providing a layered structure, where an outer layer comprises a graphene metal structure, and the graphene-metal structure comprises a metal layer and an outer graphene layer arranged on the metal layer; (b) identifying a fault location in the outer graphene layer; (c) preparing a surface of the outer graphene layer, where the surface of the outer graphene layer comprises at least the defect site; and (c) applying localized heat on the fault location, where applying the localized heat promotes the growth of graphene at the defect site. USE - The method is useful for repairing at least one layers of a laminate stack or a printed circuit board. ADVANTAGE - The method is simple and economical. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the laminate stack. 201Core 202Adhesive layer 203Graphene-metal structure 207Pressure pad