▎ 摘　　要

NOVELTY - Repairing at least one layers of a laminate stack or a printed circuit board (PCB), comprises (a) providing a layered structure, where an outer layer comprises a graphene metal structure, and the graphene-metal structure comprises a metal layer and an outer graphene layer arranged on the metal layer; (b) identifying a fault location in the outer graphene layer; (c) preparing a surface of the outer graphene layer, where the surface of the outer graphene layer comprises at least the defect site; and (c) applying localized heat on the fault location, where applying the localized heat promotes the growth of graphene at the defect site. USE - The method is useful for repairing at least one layers of a laminate stack or a printed circuit board. ADVANTAGE - The method is simple and economical. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the laminate stack. 201Core 202Adhesive layer 203Graphene-metal structure 207Pressure pad