▎ 摘　　要

NOVELTY - The DIMM has a substrate (101) having an uppermost layer of graphene that comprises multiple openings corresponding to and exposing multiple substrate pads. A memory die is mounted over the substrate on the uppermost layer of graphene and has multiple electrical connections, where each of the electrical connections is in contact with a corresponding one of the substrate pads. The uppermost layer of graphene is configured to convey thermal energy away from the memory die. The uppermost layer of graphene comprises multiple monolayers of graphene. The electrical connections comprises multiple solder joints. USE - Dual in-line memory module (DIMM) for thermal management. ADVANTAGE - The openings in the graphene layer provide electrical isolation from the pads, contacts, and solder joints by being set back from these circuit elements by a sufficient distance to prevent inadvertent electrical contact. DETAILED DESCRIPTION - AN INDEPENDENT CLAIM is included for a semiconductor device package. DESCRIPTION OF DRAWING(S) - The drawings show the simplified side and cross-sectional views of memory module. Memory module (100) Substrate (101) Edge connector (102) Memory device (103) Graphene layer (106)