▎ 摘　　要

NOVELTY - LED packaging glue comprises component (A) comprising 16-28 pts. wt. vinyl silicone oil, 4-17 pts. wt. phenyl silicone oil, 55-80 pts. wt. vinyl silicone resin and 0.1-2 pts. wt. platinum catalyst and component (B) comprising 0.1-5 pts. wt. dendrimer graphene composite material, 0.5-5 pts. wt. dendrimer gold/silver nanocrystalline composite material, 10-25 pts. wt. vinyl silicone oil, 45-70 pts. wt. vinyl silicone resin, 8-18 pts. wt. phenyl silicone oil and 12-21 pts. wt. hydrogen-containing silicone oil, where the mass ratio of component (A) and component (B) is (0.5-1):1, the dendrimer graphene composite material is prepared by dispersing graphene and dendrimer in a solvent, dispersing at 0-10 degrees C, and removing the solvent, and the dendrimer gold/silver nanocrystal composite material is obtained by loading gold/silver nanocrystals on dendrimers. USE - The packaging glue is used for the packaging of LEDs. ADVANTAGE - The packaging glue has excellent thermal stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the packaging glue involving (i) mixing vinyl silicone oil, phenyl silicone oil, vinyl silicone resin and platinum catalyst, adding the dendritic molecular composite material quantum dot composite material under normal temperature conditions, vacuum stirring and uniformly mixing to prepare the component (A), (ii) uniformly mixing dendrimer graphene composite material, dendrimer gold/silver nanocrystal composite material, vinyl silicone oil, vinyl silicone resin, phenyl silicone oil and hydrogen-containing silicone oil and mixing under vacuum at normal temperature to prepare component (B) and (iii) mixing and curing the component (A) and the component (B) in a mass ratio of (0.5-1):1 to prepare a high heat-resistant LED packaging glue.