▎ 摘　　要

NOVELTY - The integrated assembly (20) has a first graphene-containing-material (32). The first graphene-containing-material is provided with a first graphene-layer-stack and is provided with first metal interspersed between the graphene layers of the first graphene-layer-stack. A second graphene-containing-material (34) is offset from the first graphene-containing-material. The second graphene-containing-material is provided with a second graphene-layer-stack and is provided with second metal interspersed between the graphene layers of the second graphene-layer-stack. A conductive interconnect (36) couples the first graphene-containing-material with the second graphene-containing material. The elements include Y, Sc, Cr, Mo and W and La, Ce, Pr, Nd, Pm, Sm, Gd, Dy, Yb, Lu and Ac. USE - Integrated assembly for use in electronic systems such as, for example, cameras, wireless devices, displays, chip sets, set top boxes, games, lighting, vehicles, clocks, televisions, cell phones, personal computers, automobiles, industrial control systems, aircraft, etc. ADVANTAGE - The graphene-containing-material has transition metal provided between graphene planes to improve out-of-plane-conductivity. DESCRIPTION OF DRAWING(S) - The drawing shows a diagrammatic cross-sectional side views of example integrated arrangements. 20Integrated assembly 32First graphene-containing-material 34Second graphene-containing-material 36Conductive interconnect 40Circuit devices