▎ 摘　　要

NOVELTY - Graphene-modified ceramic Polytetrafluoroethylene-based Printed Circuit Board copper clad laminate comprises ceramic-based prepreg, copper foil, a ceramic-based prepreg, and a layer of chemical vapor deposited graphene between the copper foils. USE - Graphene-modified ceramic Polytetrafluoroethylene-based Printed Circuit Board copper clad laminate. ADVANTAGE - The graphene-modified ceramic Polytetrafluoroethylene-based Printed Circuit Board copper clad laminate greatly improves thermal, electrical and mechanical properties of the clad copper board. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing graphene-modified ceramic-based PCB copper clad laminate, which involves: (A) placing ceramic piece in a cavity of a chemical vapor deposition apparatus for graphene growth, and growing graphene on one or both sides; (B) placing upper and lower sides of the sample on the copper foil, and placing in a hot press furnace for hot pressing; (C) pumping vacuum in hot pressing condition to more than 1x 10-3 mbar, raising temperature, and increasing temperature rise rapidly increased to 150 degrees C for 30-50 minutes, and then heating to 380-405 degrees C for 90-100 minutes, holding time is 120-180 minutes; (D) dividing process of pressurization into two, applying pressure during the heating process is 2-3 mega pascals, and applying pressure during the heat preservation process is 2.5-3.5 MPa; (E) lowering temperature naturally to room temperature, and then releasing pressure, and where pressure relief speed should be less than 0.1 MPa/seconds; and (F) taking out pressed graphene-modified ceramic-based PCB copper clad plate from the hot press furnace to obtain finished product.