• 专利标题:   Conductive adhesive used in e.g. solid-state conductive adhesive film for electrical conduction or electromagnetic shielding, is prepared by using thermoplastic resin, thermosetting resin, conductive filler, conductive accelerator, and hardener.
  • 专利号:   CN113831876-A, CN113831876-B
  • 发明人:   HAO C, TIAN Y
  • 专利权人:   SHENZHEN SUSTC KANGDA TECHNOLOGY CO LTD
  • 国际专利分类:   C09J163/00, C09J175/04, C09J007/10, C09J007/30, C09J009/02
  • 专利详细信息:   CN113831876-A 24 Dec 2021 C09J-163/00 202234 Chinese
  • 申请详细信息:   CN113831876-A CN11120934 24 Sep 2021
  • 优先权号:   CN11120934

▎ 摘  要

NOVELTY - A conductive adhesive is prepared by using 3-5 pts. wt. thermoplastic resin, 10-60 pts. wt. thermosetting resin, 40-80 pts. wt. conductive filler, 1-10 pts. wt. conductive accelerator, and 1-15 pts. wt. hardener. USE - Conductive adhesive used in solid-state conductive adhesive film for electrical conduction or electromagnetic shielding (all claimed) for connection of devices in module. ADVANTAGE - The conductive adhesive uses thermoplastic resin and thermosetting resin as matrix, and adds a specific number of conductive fillers and a conductive accelerator, so that the conductive adhesive has excellent conductivity when the amount of conductive filler added is low. The conductive adhesive has excellent mechanical properties. The solid conductive adhesive film has high bonding strength and aging resistance. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) preparation of the conductive adhesive, which involves mixing thermoplastic resin, thermosetting resin, conductive filler, conductive accelerator, curing agent, optionally curing accelerator, optionally solvent and optionally other additives; (2) solid-state conductive adhesive film, which is prepared by drying the conductive adhesive; and (3) preparation of the solid conductive adhesive film, which involves coating conductive adhesive on substrate and drying.