▎ 摘　　要

NOVELTY - A non-fiber reinforced fluorine-containing resin based high-frequency copper-clad plate comprises a fluorine-containing resin base plate (2) positioned in the middle, and copper foils (1) positioned on two sides of the fluorine-containing resin base plate. The fluorine-containing resin substrate is prepared by: 1) mixing a coupling agent in 1-80 wt./vol.% inorganic filler solution and reacting for 0.5-72 hours, at 20-100degrees Celsius, filtering and drying to form a modified inorganic filler; 2) adding the modified inorganic filler into hydroxylated fluorine-containing resin, heating to 220-350degrees Celsius and stirring for 5-18 hours, to form a fluorine-containing resin mixture; 3) adding the fluorine-containing resin mixture into an injection molding machine, setting the temperature of a charging barrel to 250-380degrees Celsius and temperature of mold to 180-260degrees Celsius, injection molding pressure to 50-80 milli pascals (M Pa), followed by cooling at normal temperature. USE - As non-fiber reinforced fluorine-containing resin based copper-clad plate. ADVANTAGE - The fluorine-containing resin-based high-frequency copper-clad plate free from fiber reinforcement, has low hygroscopicity, low dielectric constant, low dielectric loss. The copper-clad plate containing copper foil of high peeling strength, has improved adhesiveness and resistance to shedding. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the preparation of the non-fiber-reinforced fluorine-containing resin-based high-frequency copper-clad plate. The method involves preparing the upper side and the lower side of the fluorine-containing resin substrate, and the copper foil into a lamination layer, followed by laminating steel plates on the upper side and the lower side of the lamination layer and then placing the lamination layer in a hot press, and laminating for 6-28 hours with lamination temperature 150-430degrees Celsius, and lamination pressure 50-200 kg/cm2. DESCRIPTION OF DRAWING(S) - The drawing shows cross-sectional view of non-fiber reinforced fluorine-containing resin-based high-frequency copper-clad plate. Copper foil (1) Fluorine-containing resin substrate (2)