▎ 摘　　要

NOVELTY - Halogen-free lead-clad plate without lead and high Tg comprises an electronic glass fibre cloth, glue solution, copper foil and composite modifier, where the composite modifier and glue solution are mixed with electronic glass fibre cloth for dipping, then the copper foil hot pressing forming, the weight ratio of the composite modifier and the glue solution is 1:4-10, the glue solution comprises 32.40-33.40 wt.% benzoxazine resin, 20.40-21.40 wt.% polysiloxane resin, 5.40-6.40 wt.% phosphors-containing epoxy resin, 9.50-10.30 wt.% aluminium hydroxide and the rest is organic solvent. USE - Halogen-free lead-clad plate without lead and high Tg used for interconnecting printed circuit board (PCB) with different functions and to insulating and supporting function, transmission speed of signal in circuit, energy loss and characteristic impedance. ADVANTAGE - The halogen-free lead-free high Tg copper-clad plate has improved toughness, structure strength, thermal stability and low-temperature resistance, and high heat conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing a halogen-free and lead-free high Tg copper-clad plate, involving: a. weighing the weight parts of the glue solution raw material of the benzoxazine resin, polysiloxane resin, phosphors-containing epoxy resin, aluminium hydroxide, organic solvent and composite modifier raw material in the nanometre silicon carbide, graphene, nano calcium fluoride particles, carbon fibre, nanometre silicon dioxide; b. adding the nano silicon carbide, graphene, nano calcium fluoride particles, carbon fibre, nano silicon dioxide into the de-ionized water, performing double-frequency ultrasonic treatment for 50-60 minutes to obtain the electrostatic spinning solution, then electrostatic spinning the electrostatic spinning solution to obtain the composite modifier; c. heating benzoxazine resin, polysiloxane resin, phosphors-containing epoxy resin, aluminium hydroxide, organic solvent and mixing for 50-60 minutes to obtain glue solution; d. emulsifying and shearing the two-thirds of the composite modifier and the glue solution emulsifying kettle prepared in step three for 20-30 minutes, performing the ultrasonic treatment to obtain the composite glue solution; ' e. adding the remaining composite modifying agent into the de-ionized water, ultrasonically processing for 10-20 minutes to obtain the dipping liquid, inserting electronic glass fibre cloth into the dipping liquid, dipping for 20-30 minutes and drying to obtain the pre-processed electronic glass fibre cloth; f. inserting the pre-processed electronic glass fibre cloth obtained into the composite glue solution prepared for dipping, baking the dipped electronic glass fibre cloth to obtain the prepreg; and g. copper foil hot pressing composite to the two sides of the prepreg to obtain product.