▎ 摘　　要

NOVELTY - Preparing polyphenylene oxide (PPO) resin-based copper clad laminate comprises (1) taking silicon dioxide-graphene composite material and deionized water, ultrasonically dispersing for 50-70 minutes, adding dopamine, continuously stirring for 30-40 minutes, adding trihydroxymethyl aminomethane buffering agent, heating to 55-60°C, stirring for 44-50 hours, washing and drying to obtain modified silica-graphene composite material; (2) taking modified polyphenylene ether resin, modified silica-graphene composite material and toluene, stirring at 80-100°C for 7-8 hours, cooling to 25-35°C, adding epoxy resin, curing agent, styrene, flame retardant, and initiator, stirring to obtain glue solution; and (3) taking glass fiber cloth and impregnating glue solution, and drying at 100-150°C to obtain prepreg; laminating 5-10 sheets of prepregs, and covering piece of copper foil on both sides of laminated prepreg and heat pressing at 2-4 MPa, 160-200℃ for 1-2 hours. USE - The method is useful for preparing polyphenylene oxide resin-based copper clad laminate. ADVANTAGE - The PPO resin-based copper clad laminate: has low dielectric loss, low dielectric loss and good peel strength; and meets industrial use conditions. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for PPO resin-based copper clad laminate is prepared by above mentioned method.