▎ 摘　　要

NOVELTY - Graphene conductive adhesive with high thermal conductivity and low resistance comprises 15 wt.% liquid crystal epoxy, 10 wt.% phenolic resin, 10 wt.% bismaleimide, 10 wt.% polyimide resin, 22 wt.% graphene, 10 wt.% conductive metal powder, 19 wt.% dispersant, 3.5 wt.% hardener and 0.5 wt.% curing accelerator. USE - Used as graphene conductive adhesive with high thermal conductivity and low resistance. ADVANTAGE - The adhesive has high temperature resistance, high heat dissipation, lower resistivity, and has high tensile strength. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing graphene conductive adhesive with high thermal conductivity and low resistance value comprises (1) weighing each substance according to the weight percentage of the component, (2) adding the liquid crystal epoxy resin, phenolic resin, bismaleimide, polyimide resin and dispersant into the mixer to stir uniformly, adding the graphene filler and conductive metal powder into the mixer, stirring uniformly, (3) adding curing agent and curing accelerator into the mixer, ensuring fully mixing uniformly, stirring at high speed, stirring for 30 minutes to obtain the conductive adhesive.