▎ 摘　　要

NOVELTY - The device has a workpiece unit that includes a workpiece (3), and is integrally distributed with an array through-hole structure. The workpiece unit is installed between an upper clamp structure (7) and a lower clamp structure (11). The electroforming liquid enters the flow channel of the upper clamp structure from the incoming liquid. A portion of incoming liquid flows out from the liquid outlet after passing through the flow channel of the upper clamp structure, and the other portion enters the flow channel of the lower clamp structure through the through hole of the workpiece and then flows out of the liquid outlet. The anode is adapted to the specific flow channel of the upper clamp. USE - Array through hole electroforming processing device used in manufacture of sophisticated and complex metal portions and various molds. ADVANTAGE - The device designs reasonable flow channels and anodes according to the distribution of the through holes on the surface of the workpiece, more effectively controls the electroforming processing area, and is conducive to the deposition of materials on the inner walls of the through holes. The device provides a two-dimensional material modification method, such as improving the longitudinal thermal conductivity of the two-dimensional material graphene based on the through-hole electroforming device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for modifying two-dimensional material. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the array through-hole electroforming processing device. 3Workpiece 7Upper clamp structure 11Lower clamp structure 19Electricity-guiding sheet 21Centrifugal pump