▎ 摘　　要

NOVELTY - An insulation sheet (110) is provided on the opposite surface of a printed circuit film from the surface on which a display driver integrated chip is mounted, for preventing the transfer of heat generated from the display driver integrated chip, and consists of a graphite sheet as a thermal insulation component having a function of transferring the received heat to the surface direction including a surface (s1) and a surface (s2) facing each other in a direction perpendicular to the thickness direction, than the thickness direction, a metal substrate (122) capable of forming a hot spot, an adhesive component (120') having an adhesive layer (123) attached to the opposite surface of the printed circuit film and an adhesive layer (121) attached to the surface (s1) of the thermal insulation component, and a protection component (130) provided on the surface (s2) of the thermal insulation component. USE - Insulation sheet is used for structure used in chip-on-film package of module used in display device (all claimed). ADVANTAGE - The insulation sheet has excellent adhesiveness, flexibility, and peeling resistance, even when attached to curved printed circuit film, and prevents the occurrence of heat transfer in an undesired direction, while reducing the heat-generation level of the heating element, dust scattering caused by damage or destruction of the inner layer of the insulation sheet, and malfunction or damage of electronic components. DETAILED DESCRIPTION - An insulation sheet is provided on the opposite surface of a printed circuit film from the surface on which a display driver integrated chip is mounted, for preventing the transfer of heat generated from the display driver integrated chip in a direction (d1) perpendicular to the opposite surface, and consists of a graphite sheet as a thermal insulation component having a function of transferring the received heat to the surface direction including a surface (s1) and a surface (s2) facing each other in a direction perpendicular to the thickness direction, than the thickness direction, for minimizing the heat transfer from the surface (s1) to the direction (d1), a metal substrate capable of forming a hot spot larger than the area of the display driver integrated chip and having a high-temperature reliability, an adhesive component (120') having an adhesive layer (123) attached to the opposite surface of the printed circuit film at a position corresponding to the display driver integrated chip and an adhesive layer (121) attached to the surface (s1) of the thermal insulation component, and a protection component provided on the surface (s2) of the thermal insulation component. The heat is transferred to the surface (s1) adjacent to the display driver integrated chip for lowering the heating temperature of the display driver integrated chip. INDEPENDENT CLAIMS are included for the following: (1) chip-on-film package, which consists of the printed circuit film, the display driver integrated chip provided on one surface of the printed circuit film, and the insulation sheet provided on the opposite surface of the printed circuit film; (2) display module, which consists of a display panel unit, a circuit board spaced apart from the display panel unit, and the chip-on-film package having one end electrically connected to the display panel unit and the other end electrically connected to the circuit board; (3) display device, which consists of the display module and a housing surrounding at least a portion of the display module; and (4) insulation structure, which consists of a heating element and the insulation sheet provided on the heating element. DESCRIPTION OF DRAWING(S) - The drawing shows the cross-sectional schematic view of chip-on-film package. Insulation sheet (110) Adhesive component (120') Adhesive layers (121,123,132) Substrate (122) Protection component (130)