▎ 摘　　要

NOVELTY - The electronic equipment has a chip (2) located on surface of circuit board (1). A first thermal interface material layer (41) in thermal interface material layer (4) is located on the chip away from the circuit board surface. A radiator (3) is located on the first thermal interface material layer away from the chip surface. Each of the thermal interface material layer comprises a frame (42) and a filler (43). The filler is filled in a space (44) enclosed by the frame. The frame and the filler are provided with thermal conductivity. The frame has rebound resilience. The filler has fluidity. USE - Electronic equipment. ADVANTAGE - The frame has rebound resilience, and the contact and chip are flexible contact which can increase the bonding degree of the frame and the chip and the radiator. The filler has fluidity, and increases the filler and chip contact, radiator between the contact so the thermal interface material layer can well absorb the chip surface and radiator between surface, accelerate the heat transfer chip the radiator and radiator, and can improve the radiating effect of the electronic equipment. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a manufacturing method of the electronic equipment. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic diagram of an electronic equipment. Circuit board (1) Chip (2) Radiator (3) Thermal interface material layer (4) Bottom plate (31) Radiating teeth (32) First thermal interface material layer (41) Frame (42) Filler (43) Space (44)