▎ 摘　　要

NOVELTY - Engraved composite film comprises a base layer (1), an engraving layer (2) and an antistatic layer (3); the engraving layer is arranged between the base layer and the antistatic layer; the base layer comprises 85-98 pts. wt. polyethylene terephthalate particles and 2-15 pts. wt. insulating oil; the engraving layer comprises 96-98 pts. wt. photoresist and 2-4 pts. wt. UV glue; and the antistatic layer comprises 75-85 pts. wt. polyethylene terephthalate particles, 10-20 pts. wt. antistatic masterbatch and 2-10 pts. wt. graphene. USE - The engraved composite film is useful for producing circuit board (claimed). ADVANTAGE - The engraved composite film: improves the control force of charge arrangement and thus greatly improves the antistatic performance; improves the connection strength between the structure layers; avoids pollution; and improves the clarity of the circuit. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing engraved composite film, comprising (i) taking the plate-shaped carrier, cleaning and drying and adopting combination of wet cleaning, deionized water washing and dehydration baking to remove carrier contaminants and water vapor, (ii) thinly coating the base layer, melting the polyethylene terephthalate particles and adding insulating oil to mix to obtain base liquid and spraying the base liquid on the carrier, (iii) spin coating the engraving layer, spin coating UV glue and photoresist on the surface of the base layer in sequence, (iv) curing the UV glue by UV irradiation, then covering the mask plate on the surface of the engraving layer and performing scanning and stepping projection exposure, (v) developing by using combination of continuous spraying and automatic rotation, i.e. adopting at least one nozzles to spray the developing solution on the surface of the photoresist, allowing to stand, hard-baking at 100-130degrees Celsius for 1-2 minutes while the carrier rotating at a low speed of 100-500 revolutions/minute and spin-coaing the UV glue on the surface of the photoresist after development, and (vi) spin coating the antistatic layer, taking the polyethylene terephthalate particles and melting and mixing with graphene as shielding liquid, taking polyethylene terephthalate particles and antistatic master batch, melting and mixing into antistatic liquid, spin-coating antistatic liquid, shielding liquid and antistatic liquid on the surface of the engraving layer in sequence. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the engraved composite film for producing circuit board. Base layer (1) Engraving layer (2) Antistatic layer (3)