• 专利标题:   Heat dissipation material used in heat dissipation of heat generating devices, comprises graphene, silver nanoparticles and polyvinylidene fluoride, where graphene vinyl is modified and dispersed in polyvinylidene fluoride, and silver nanoparticles are adsorbed on graphene surface.
  • 专利号:   CN116063808-A
  • 发明人:   HU B, GUO H, LI B
  • 专利权人:   UNIV NANKAI
  • 国际专利分类:   C08K003/04, C08K003/08, C08K009/06, C08K009/12, C08L027/16, H05K007/20
  • 专利详细信息:   CN116063808-A 05 May 2023 C08L-027/16 202347 Chinese
  • 申请详细信息:   CN116063808-A CN10077672 16 Jan 2023
  • 优先权号:   CN10077672

▎ 摘  要

NOVELTY - Heat dissipation material comprises graphene, silver nanoparticles and polyvinylidene fluoride, where the graphene vinyl is modified and dispersed in polyvinylidene fluoride, the silver nanoparticles are adsorbed on the graphene surface to form a graphene/silver nanoparticle heterostructure, and the graphene/silver nanoparticle heterostructure is arranged in a horizontal orientation. USE - The heat dissipation material is used in heat dissipation of heat generating devices (claimed). ADVANTAGE - The heat dissipation material has excellent anisotropic thermal conductivity, excellent heat dissipation capability and excellent mechanical strength, and can be applied to high-power LED chip cooling with outstanding effect. The method is simple in process, easy to scale up and produce, and has industrial application prospects. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the heat dissipation material comprising (a) mixing the graphene oxide dispersion liquid and the modifying agent to carry out the vinyl modification reaction, adding the silver ion solution and the reducing agent successively, and preparing the graphene with the silver nanoparticles adsorbed on the surface after the reduction reaction, and (b) dispersing the graphene with silver nanoparticles adsorbed on the surface obtained in step (a) in a solvent, then add polyvinylidene fluoride to form a casting solution, and sequentially performing film formation and stress-induced orientation to prepare a heat dissipation material.