▎ 摘　　要

NOVELTY - The method involves forming a metal layer on one surface of the planar diaphragm main portion, where the thickness of the planar diaphragm main portion is 0.5 m to 6 m, and the thickness of the metal layer is 1 nm to 20 nm. A graphene oxide circuit is formed on the metal layer by electrostatic spraying. The metal layer is etched, and a metal line (50) is formed on the metal layer. A graphene oxide line (60) is reduced into reducing graphene oxide line to obtain a voice coil circuit (70), where the thickness of the reducing graphene oxide circuit is less than 50nm. USE - Preparation method of planar diaphragm assembly used in loudspeaker. ADVANTAGE - The method solves the contradiction that the ultra-thin thickness and the electrical conductivity performance in the existing processing voice coil circuit technique cannot be improved at the same time. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a planar diaphragm speaker. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the planar diaphragm assembly obtained after reduction of the graphene oxide line. 10Plane vibration film main portion 50Metal line 60Reduction-oxidation graphene line 70Voice coil circuit 100Planar vibrating film assembly