▎ 摘　　要

NOVELTY - The pad has a box body buckled on an upper part of a box cover that is formed with a through hole. A heating component and a radiating component are arranged in the box body. The heating component is provided with first and second graphene heat conducting sheets and first and second semiconductor refrigerating sheets. Upper surfaces of the first semiconductor refrigerating sheet and the first graphene heat conducting sheet are contacted with an upper surface of the second semiconductor refrigerating sheet. A lower surface of the first semiconductor refrigerating sheet is connected with the second graphene heat conducting sheet. USE - Cooling-heating-type cup pad. ADVANTAGE - The pad has low-power-consumption, high heat conducting coefficient, small volume, low noise and high working efficiency, absorbs heat generated by the semiconductor refrigerating sheet through a graphite thermal fin, and effectively improves refrigeration efficiency. DESCRIPTION OF DRAWING(S) - The drawing shows an exploded perspective view of a cooling-heating-type cup pad.