▎ 摘　　要

NOVELTY - An one-component thermal-gel composition comprises (A) a crosslinkable organopolysiloxane prepared by reaction of (i) an alkenyl-functionalized diorganopolysiloxane (Ia) and (ii) a hydrogen-functionalized organopolysiloxane (Ib), (B) a hydrolyzable organopolysiloxane chosen from compounds (II)-(IV), (C) a thermal conductivity enhancing agent, (D) optionally an organopolysiloxane having an average of at least one silicone bonded alkenyl group per molecule, (E) optionally an adhesion promoter, (F) optionally an antioxidant, and (G) optionally a pigment. USE - One-component thermal-gel composition and heat dissipating material for dissipating heat from substrate for preparing treated substrate and device (all claimed). ADVANTAGE - The thermal-gel composition has high thermal conductivity while maintaining the desired processability, dispensability, and high reliability performance including controlling vertical slippage, cracking, and delamination at different application gaps that are required for easy application and long term stability. DETAILED DESCRIPTION - An one-component thermal-gel composition comprises (A) a crosslinkable organopolysiloxane prepared by reaction of (i) an alkenyl-functionalized diorganopolysiloxane of formula: M1aM2bD1cD2dT1eT2fQg(Ia), (ii) a hydrogen-functionalized organopolysiloxane of formula: M'1a'M'2b'D'1c'D'2d'T'1e'T'2f'Q'g' (Ib), (B) a hydrolyzable organopolysiloxane chosen from compounds of formulae (II)-(IV), (C) a thermal conductivity enhancing agent, (D) optionally an organopolysiloxane having an average of at least one silicone bonded alkenyl group per molecule, (E) optionally an adhesion promoter, (F) optionally an antioxidant, and (G) optionally a pigment. M =R R R SiO ; M =R R R SiO ; D =R R SiO ; D =R R SiO ; T =R SiO ; T =R SiO ; Q=SiO ; R -R ,R -R ,R =1-60C monovalent aliphatic hydrocarbyl, 1-60C monovalent aryl, 1-60C monovalent fluorohydrocarbyl, or alkoxy; R ,R ,R =monovalent radical containing at least one terminal olefin bond; a-g=0 or more; a+b+c+d+e+f+g=1-6000; a+c+e=1 or more; M' =R R R SiO ; M' =R R R SiO ; D' =R R SiO ; D' =R R SiO ; T'1=R SiO ; T' =R SiO ; Q'=SiO ; R -R ,R -R ,R =1-60C monovalent aliphatic hydrocarbyl, 1-60C monovalent aryl, or 1-60C monovalent fluorohydrocarbyl; R ,R ,R =H; a'-g'=0 or more; a'+b'+c'+d'+e'+f'+g'=1-6000; a'+c'+e'=1 or more; R =group containing 1-4C alkoxysilyl; R =linear organosiloxy group; R =1-12C monovalent hydrocarbyl; L=1-6C monovalent hydrocarbyl, or 1-4C alkoxysilyl; k=10-500; X=2-10C divalent hydrocarbyl; h,i=1 or more; j=0 or more; h+i+j=4 or more; R =H or 1-6C monovalent hydrocarbyl; R =optionally substituted alkyl, alkenyl or aryl; R =R ; R ,R =optionally substituted monovalent hydrocarbyl; R =H, or optionally substituted monovalent hydrocarbyl; R =optionally substituted alkyl, alkoxyalkyl, alkenyl or acyl; m=0-4;and n=2-20. INDEPENDENT CLAIMS are included for the following: a device, which consists of a substrate (s1), a substrate (s2), and an interface material bridging an interface between the substrates (s1) and (s2). The thermal interface material comprises the one-component thermal-gel composition; a heat dissipating material, which comprises the thermal gel composition; dissipating heat from substrate, which involves contacting the substrate with the thermal gel composition or the heat dissipating material; and preparation of treated substrate, which involves applying the thermal gel composition or the heat dissipating material to a surface of a substrate.