▎ 摘　　要

NOVELTY - Heatconducting structure comprises a heat conducting metal layer, and a structure layer, which is arranged on a heat-conducting metal layer. (11) The structural layer is a stack structure formed by a graphene layer (12) and a ceramic material layer (13), or the structure layer is graphene-coated ceramics layer. USE - Heat conducting structure for use in electronic device (claimed). ADVANTAGE - The heat conducting structure can quickly conduct the heat generated by the heat source of the electronic device to the outside, and improve the radiating efficiency. The ceramic material layer can provide protection and insulation effect, but also can improve the heat conducting effect. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of heat conducting structure of heat-conducting structure. 1Heat-conducting structure 11Heat-conducting metal layer 12Graphene layer 13Ceramic material layer