▎ 摘　　要

NOVELTY - A polymer composition (C1) comprises a polymer matrix; a graphene that is covalently bonded to the polymer matrix; and metal particles having an additive covalently bonded to it. The additive comprises thiol, silane, silanol, monodentate amine and/or bidentate amine. The combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold. The grapheme has carbon:oxygen ratio of at least 20:1. USE - As an electrically conductive polymer composition or a lead-free solder material useful for forming connection; for reworking a connection (all claimed); and in a variety of commercial, electronics, industrial, and military products. ADVANTAGE - The polymer composition has a sheet resistivity of less than 0.01 ohm/square; allows multiple rework operations to take place at a connection; and has enhanced performance under extreme conditions. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) making (M1) the polymer composition involving reacting a graphene having a carbon:oxygen ratio of at least 20:1 with a thermoplastic material to form covalent bonds, and adding metal particles to the thermoplastic material, where the metal particles have an additive covalently bonded to it, and the additive comprises thiol, silane, silanol, monodentate amine and/or bidentate amine and a combined concentration of the metal particles and the graphene in the thermoplastic material exceeds an electrical percolation threshold; (2) forming (M2) a connection involving heating a solder material to at least its softening temperature, where the solder material comprising the composition (C1), placing at least one member in the softened solder material, and cooling the softened solder material to affect hardening and to affix the at least one member to it; (3) reworking (M3) a connection involving heating a connection comprising at least one member and a solder material to at least a softening temperature of the solder material, where the solder material comprising the composition (C1), and removing the at least one member from the connection.