▎ 摘　　要

NOVELTY - Preparing graphene high-temperature electric heating film based on LIG method involves (i) forming a polyimide-copper electrode composite layer, fully or partially embedding the copper electrode in polyimide film, (ii) forming a polyimide material layer on surface of polyimide film-copper electrode composite layer to form a polyimide-copper electrode-polyimide material layer to be layer-induced graphene (LIG) layer combination, (iii) performing LIG processing on polyimide material layer, and conducting laser transmission to form a graphene heating layer pattern to form a polyimide film-copper electrode composite LIG layer structure, and (iv) encapsulating a protective film layer on surface of patterned graphene layer. The specific method of step (i) involves coating a thermoplastic polyimide prepolymer (polyamic acid) on surface of copper electrode, drying and semi-curing to form a polyamic acid film, and subjecting to high-temperature compression and imidization with polyimide film. USE - Method useful for preparing graphene high-temperature electric heating film based on LIG method. DETAILED DESCRIPTION - Method for preparing graphene high-temperature electric heating film based on LIG method involves (i) forming a polyimide-copper electrode composite layer, the copper electrode is fully or partially embedded in the polyimide film, (ii) forming a polyimide material layer on the surface of the polyimide film-copper electrode composite layer to form a polyimide-copper electrode-PI material layer to be layer-induced graphene (LIG) layer combination, (iii) performing LIG processing on the polyimide material layer, and conducting laser transmission to form a graphene heating layer pattern to form a polyimide film-copper electrode composite LIG layer structure, and (iv) encapsulating a protective film layer on the surface of the patterned graphene layer. The specific method of step (i) involves coating a thermoplastic polyimide prepolymer (polyamic acid) on the surface of the copper electrode, drying and semi-curing to form a polyamic acid film, and subjecting to high-temperature compression and imidization with the polyimide film to form a polyimide-copper electrode composite. The specific method of step (ii) involves (a) taking the polyimide film, coating the surface of the thermoplastic polyimide prepolymer (polyamic acid), drying to form a semi-cured polyamic acid film, forming a polyimide-polyamic acid film material, and opening holes for the polyimide-polyamic acid film material, (b) covering the porous polyimide-polyamic acid film material on the surface of the polyimide film-copper electrode composite layer, aligning the opening with the copper electrode, and exposing the copper electrode through the opening to form a polyimide-copper electrode-polyamic acid film material-polyimide structure, and (c) pressing the obtained structural portions, completing the imidization treatment of the polyamic acid membrane material, and fusing the polyimide-polyamic acid film material to form a completed polyimide material layer to obtain the product.