▎ 摘　　要

NOVELTY - The utility model claims an IC packaging carrier plate, comprising a packaging substrate, the lower end of the packaging substrate is provided with multiple welding balls, four corners of the upper end of the packaging substrate are provided with a through hole, the middle part of the upper end of the packaging substrate is provided with multiple contacts, the multiple contacts are connected with a chip, the upper end of the packaging substrate is provided with four screw rods distributed in rectangular array, the outer surface of the four screw rods are movably sleeved with a radiating component, the middle part of the outer surface of the four screw rods is sleeved with a baffle block, the four screw rods are screw thread with a nut, the lower end of the radiating component and the upper end contact the chip . The IC packaging carrier plate of the utility model can heat and protect the chip by setting the radiating component, which ensures the normal operation of the chip, the radiating effect of the radiating plate and the radiating fin can be further improved by setting the graphene heat radiation coating, so as to achieve the effect of high-efficiency cooling.