• 专利标题:   Thermal interface material with vertical sandwich structure, comprises thermally conductive filler and polymer material with flexibility.
  • 专利号:   CN113214583-A, CN113214583-B
  • 发明人:   CHEN M, WU L, HUANG T
  • 专利权人:   UNIV FUDAN
  • 国际专利分类:   C08J005/18, C08K003/04, C08K003/38, C08L029/04, C09K005/06
  • 专利详细信息:   CN113214583-A 06 Aug 2021 C08L-029/04 202185 Pages: 9 Chinese
  • 申请详细信息:   CN113214583-A CN10370488 07 Apr 2021
  • 优先权号:   CN10370488

▎ 摘  要

NOVELTY - Thermal interface material with a vertical sandwich structure comprises thermally conductive filler and polymer material with flexibility, where the addition amount of thermally conductive filler and polymer material is 2.5-25 %mass. USE - As thermal interface material. ADVANTAGE - The thermal interface material has bidirectional high thermal conductivity and excellent mechanical properties, improves the heat dissipation performance, does not need to use complex and expensive processing equipment and severe processing conditions, and is beneficial to large-scale production. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the thermal interface material with a vertical sandwich structure involving (i) measuring 10 ml deionized water, adding 0.15-0.3 g sodium alginate and 0.1-1.2 g polymer material, uniformly stirring and mixing under corresponding dissolution conditions, adding 0.01-0.2 g thermally conductive filler and stirring to obtain mixed gel solution, (ii) dripping the mixed gel solution obtained in the step (i) onto a flat substrate, placing ice containing calcium ions on the gel to form a film, freezing, removing calcium ion ice to obtain a frozen gel film and (iii) soaking the frozen film obtained in the step (ii) in ethanol and acetone and drying under normal pressure and drying under normal pressure to obtain thermal interface material with a vertical sandwich structure.