• 专利标题:   Electroplating high density interconnection (HDI) board with high multi-layer blind hole, has four fixing seats that are upper end with fixing screw, and HDI board lower end that is provided with radiating device.
  • 专利号:   CN218183597-U
  • 发明人:   WU W, WU L
  • 专利权人:   SHENZHEN WANCHUANGXING ELECTRONICS CO
  • 国际专利分类:   H05K001/02, H05K005/02, H05K007/14, H05K007/20
  • 专利详细信息:   CN218183597-U 30 Dec 2022 H05K-001/02 202304 Chinese
  • 申请详细信息:   CN218183597-U CN22038852 04 Aug 2022
  • 优先权号:   CN22038852

▎ 摘  要

NOVELTY - The utility model claims an electroplating HDI board of high multi-layer blind hole, comprising an HDI board, the HDI board is upper end with a circuit layer, the HDI board upper end left, the upper end middle part and the upper end right part are provided with a group of blind holes, the HDI board left end and the right end are jointly installed with a protective device, the left end and the right end of the protective device are installed with a mounting device, the left end and the right end of the mounting device are provided with two fixing seats, the upper ends of the four fixing seats are provided with a fixing screw, the lower end of the HDI board is provided with a radiating device. The utility model claims an electroplating HDI board with high multi-layer blind hole, the HDI board is installed by the way of spring clamping by the mounting device, so as to improve the HDI board mounting and dismounting efficiency, the protection device protective frame and the supporting plate can protect the HDI board, improves the HDI board bending resistance, through the radiating device heat conducting copper foil and graphene radiating fin, so as to improve the radiating performance of the HDI board.