▎ 摘　　要

NOVELTY - A device comprises load plate (1) and load plate base (2). The load plate is provided with matrix array (linear matrix or circumferential matrix) or irregularly arranged load-carrying copper substrate load hole (3). The lower portion of load hole is provided with lead-out hole (4) coaxial with load hole, has diameter that is less than load hole, and passes through lead-out hole of load plate. The load plate base is provided with supporting column (5) equal to leading-out hole, and coaxial and matched with each other. USE - The device is used for batch transferring graphene to network-carrying copper substrate. ADVANTAGE - The device and method can transfer graphene to network copper substrate in batch, and be modified and designed transfer process and device according to actual requirement, and has simple operation. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for batch transferring graphene to network-carrying copper substrate comprising: (A) spin-coating 1-10% poly(methyl methacrylate) (PMMA) solution on surface of copper foil grown with graphene by chemical vapor deposition (CVD) method, low-speed spin coating at speed of 500-2000 revolutions/second, and high-speed spin coating at speed of 2000-5000 revolutions/second, and putting copper foil spin-coated with PMMA on heating platform for solidifying at 50-180 degrees C for 3-10 minutes; (B) pre-etching using 0.1-1.5 M etching solution (ammonium sulfate or ferric trichloride) for 2-4 periods for 2-6 minutes each cycle, slowly washing surface using deionized water, removing graphene layer existing on etching surface, etching pre-etched sample using 0.1-1.5 M etching solution (ammonium persulfate or ferric trichloride), and removing copper foil to obtain PMMA/graphene film; (C) rinsing using deionized water containing 2-15% surfactant including isopropanol or ethanol, controlling water level descending or using auxiliary appliance (load tray bracket, tweezers) to make load graphene/PMMA film on surface of load plate placed with network copper substrate, pushing out network copper substrate placed in load hole through load plate base supporting column, tightly contacting network copper substrate and graphene/PMMA film, and naturally drying or drying in heating platform at 80-150 degrees C to obtain PMMA/graphene/loaded copper substrate sample; and (D) inverting in loading hole of loading copper substrate of loading plate, using acetone steam obtained at 70-150 degrees C to remove PMMA film on PMMA/graphene/loading copper substrate sample within 0.5-3 hours, removing PMMA film by acetone steam, using isopropanol steam obtained at 70-150 degrees C to remove remained acetone on surface of sample within 0.5-3 hours, and attaching remaining graphene on copper substrate of carrier netwotk. DESCRIPTION OF DRAWING(S) - The drawing shows a three-dimensional schematic diagram of load plate and load plate assembly of device. Load plate (1) Load plate base (2) Load hole (3) Lead-out hole (4) Supporting column (5)