▎ 摘　　要

NOVELTY - A LED package includes a substrate, LED chip, sealant layer and quartz glass that are arranged in turn. The sealant layer includes a graphene oxide-based fluororesin sealant layer and KH-550 (RTM: gamma -aminopropyltriethoxysilane) silane coupling agent layer. The graphene oxide-based fluororesin sealant layer comprises graphene oxide dispersion and a fluororesin matrix. The KH-550 (RTM: gamma -aminopropyltriethoxysilane) silane coupling agent layer includes a deionized water solution and a silane coupling agent. USE - LED package (claimed). ADVANTAGE - The LED package has high bonding ability of the fluororesin sealant and excellent sealing performance, so that the reliability of the LED package is ensured. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacturing method of LED package, which involves (i) coating KH-550 (RTM: gamma -aminopropyltriethoxysilane) silane coupling agent solution on LED chip surface and bottom of quartz glass, evenly coating, and baking to form KH-550 (RTM: gamma -aminopropyltriethoxysilane)silane coupling agent layer, (ii) coating the surface of the LED chip with graphene oxide-based fluororesin sealant, forming graphene oxide-based fluororesin sealant layer, vacuum-degassing KH-550 (RTM: gamma -aminopropyltriethoxysilane) silane coupling agent layer and graphene oxide-based fluororesin sealant layer to form sealing layer, (iii) installing quartz lens to form LED package, and (iv) baking LED package.