▎ 摘　　要

NOVELTY - The chip module (101) has a chip (110) that is coupled to an electrically conductive region (102) comprising a metal. A coating of the electrically conductive area is provided with a layer (104) of the organic silicon compound or a carbon compound in a thickness, which has an electrical surface contact resistance of not more than 500 mΩ according to ISO 7810 when measured according to ISO 10373-1. USE - Chip module with chip set up for typical smart card application such as payment processes. ADVANTAGE - The free-jet plasma coating can be advantageous in that a free-jet plasma system is sometimes already used in the chip module production process for cleaning the chip module carrier and can easily be used in addition to the coating. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of forming a chip module. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional view of a chip module. 100Chip card 101Chip module 102Electrically conductive region 104Layer of the organic silicon compound 110Chip