▎ 摘　　要

NOVELTY - The structure has an inner layer base frame (1) coated with a heat conducting powder (3). A side of the heat conducting powder far away from the inner layer base frame is covered with MQ resin (4) i.e. vinyl MQ resin. The MQ resin far away from a side of the inner layer base frame is provided with graphene radiation patch (5). Outer graphene of the radiation patch is matched with a polymer patch mechanism. A periphery of the inner layer base frame is provided with a sealing edge mechanism for blocking MQ resin creep deformation. The heat conducting powder is made of flaky carbon and aluminum oxide materials. A baffle strip (2) is made of aluminum, silver and copper materials. USE - Heat-conducting gasket matrix arranging array-type structure for heating electronic component e.g. heat source and radiating sheet/metal base of heating device. ADVANTAGE - The gasket realizes the heat conducting gasket radiating process through the inner base frame and the outer base frame, so that the device can support and limit the inner radiating mechanism formed by MQ resin and heat conducting powder in the device in the process of using, thus reducing the occurrence of overheating vermicularization deformation, and enhancing the bonding effect between the device and the electronic element and the radiator by the polymer patch mechanism, and hence prolonging the service life of the device. DESCRIPTION OF DRAWING(S) - The drawing shows an exploded perspective view of a heat-conducting gasket matrix arranging array-type structure. 1Inner layer base frame 2Blocking strip 3Heat conducting powder 4MQ resin 5Graphene radiation patch 6Glue-based patch 7Outer frame 8Plastic sheet