▎ 摘　　要

NOVELTY - The method involves dispersing the graphene nanoplatelets (10) in a solvent with low evaporation temperature. The solvent containing the graphene nanoplatelets is poured over a thin mesh of material. The solvent is removed to form a uniformly oriented graphene layer. The graphene layer with a metal is filtrated to form a thin layer of the graphene metal matrix composite. The uniformly oriented graphene layer is included within the metal matrix. Multiple layers of thin metal graphene composite are formed and stacked to form a composite block of specific thickness. USE - Method of forming graphene metal matrix composite for semiconductor device and electronic and electrical equipments. ADVANTAGE - Since the graphene nanoplatelets are uniformly distributed in the metal matrix, the thermal conductivity over the matrix metal can be increased in the orientation plane of the graphene nanoplatelets while reducing the weight. The heat can be conducted away from heat generating component such as semiconductor device. Thus improved cooling to the semiconductor device can be provided. Improved thermal conductivity-to-weight ratio than graphite or carbon nanotube embedded metal matrix heat spreaders can be obtained. The mechanical stress issues can be improved. The cost is lower. The weight of thermal management system is reduced. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of the graphene nanoplatelet. Graphene nanoplatelet (10) Height of graphene nanoplatelet (H) Length of graphene nanoplatelet (L) Width of graphene nanoplatelet (W) Axes (X,Y,Z)