▎ 摘　　要

NOVELTY - Boron nitride-coated sulfonated graphene-epoxy resin composite material comprises 65-85 pts. wt. epoxy resin powder, 10-30 pts. wt. boron nitride powder, 1-5 pts. wt. sulfonated graphene powder, 0.5-2.5 pts. wt. silane coupling agents, and 1-10 pts. wt. low molecular weight polyamide curing agent. USE - The composite material is useful for electronic packaging materials. ADVANTAGE - The composite material has excellent thermal conductivity, good dielectric property and excellent thermal stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing boron nitride coated sulfonated graphene-epoxy composite material, comprising (i) dissolving silane coupling agent in 95% ethanol solution, stirring and hydrolyzing, adding boron nitride powder according to silane coupling agent mass ratio of 100:1.2-1.8, stirring in a water bath at 80 degrees C, cooling, filtering, washing and drying to obtain modified boron nitride powder; (ii) ultrasonically dispersing the modified boron nitride powder and the sulfonated graphene powder in a mass ratio of 10:1-3, respectively, adding the two dispersions dropwise, mixing, by electrostatic self-assembly, coating the boron nitride particles on the surface of the sulfonated graphene, stirring and mixing uniformly at normal temperature, and drying to obtain boron nitride/sulfonated graphene composite powder; (iii) heating the epoxy resin at 40-60 degrees C to improve its flow properties, adding low molecular weight polyamide curing agent, and spraying the resin onto the substrate in a vacuum environment on the surface, a single layer of resin layer having a thickness of 1-3 mu m is formed, and uniformly spraying boron nitride/sulfonated graphene onto the surface of the resin layer to form a single layer, spraying thermally conductive filler layer with the resin and boron nitride/sulfonated graphene.