• 专利标题:   Heterojunction diode using two-dimensional thin film insertion layer, has second semiconductor layer that is semiconductor laminated on two-dimensionally thin-film insertion layer, and lower electrode that is made of aluminum.
  • 专利号:   KR2021153337-A, KR2342876-B1
  • 发明人:   BAE S Y, JUNGSUNGMIN, MYUNGHYUN L, SHIN Y J, SEO D H, KIM Y H
  • 专利权人:   KOREA INST CERAMIC ENG TECHNOLOGY
  • 国际专利分类:   H01L029/861, H01L021/02, H01L029/16, H01L029/24, H01L029/66
  • 专利详细信息:   KR2021153337-A 17 Dec 2021 H01L-029/861 202104 Pages: 21
  • 申请详细信息:   KR2021153337-A KR070243 10 Jun 2020
  • 优先权号:   KR070243

▎ 摘  要

NOVELTY - The heterojunction diode has a first semiconductor layer (100) that is a semiconductor. A two-dimensional thin-film material is formed on the first semiconductor layer and second semiconductor layer (300). A second semiconducting layer is laminated on the two-dimension thin film insertion layer. The first and the second semicconducting layers are made of silicon carbide, graphene and gallium oxide. A lower electrode (500) is made of aluminum. The lower electrode has a thickness of 20 nm or more and an aluminum layer that are sequentially provided on the second and third semiconductive layers. An upper electrode (400) is provided with a titanium layer and a gallium nitride layer. USE - Heterojunction diode using two-dimensional thin-film insertion layer. ADVANTAGE - The deterioration of physical properties due to the defects can be minimized. The change in the physical properties of the diode can be prevented. The two-dimensional thin-film insertion layer can be formed without a deposition process. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a heterojunction diode manufacturing method. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a heterojunction diode using a two-dimensional thin-film insertion layer. First semiconductor layer (100) Two-dimensional thin-film insertion layer (200) Second semiconductor layer (300) Upper electrode (400) Lower electrode (500)