• 专利标题:   Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.
  • 专利号:   CN115850788-A
  • 发明人:   CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D
  • 专利权人:   UNIV JILIN
  • 国际专利分类:   B82Y030/00, C08G073/10, C08J009/28, C08J009/36, C08K003/04, C08K007/00, C08L079/08, C09K005/14, C25D005/56
  • 专利详细信息:   CN115850788-A 28 Mar 2023 C08J-009/28 202333 Chinese
  • 申请详细信息:   CN115850788-A CN10003431 03 Jan 2023
  • 优先权号:   CN10003431

▎ 摘  要

NOVELTY - Method for preparing a thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating the aerogel material, and vacuum hot pressing to obtain the thermally conductive filler/polyimide aerogel metallized composite material. USE - The method is used for preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material (claimed). ADVANTAGE - The method improves thermal conductivity of the polymer, is simple to operate, and has short experiment period. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material prepared by the above method.