▎ 摘　　要

NOVELTY - Composition comprises 30-80 pts. wt. polyamide, 0-10 pts. wt. thermosetting resin, 10-40 pts. wt. thermally conductive filler, 10-20 pts. wt. glass fiber, 1-10 pts. wt. toughening agent, 0.01-1 pts. wt. antioxidant and 0.01-1 pts. wt. lubricant. USE - The composition is useful for Fifth Generation mobile phone middle frame. ADVANTAGE - The composition is a high-strength and high thermal conductivity polyamide material, which solves the problems of low thermal conductivity and low mechanical properties of thermal conductive materials, and has excellent thermal conductivity, mechanical strength, and dimensional stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparation method of the composition, comprising placing a uniformly mixed polyamide, epoxy resin and toughening agent into a main feed port of the twin-screw extruder, adding glass fiber into a feeding port on the first side of the extruder, adding uniformly mixed thermally conductive filler, toughening agent, antioxidant and lubricant into the feeding port on the second side of the extruder, setting the processing temperature to 250-280 degrees C and the screw speed to 650-850 revolutions/minute, vacuuming the melt in the penultimate section of the die, controlling the vacuum degree at 50-80 cm-mercury, extruding the composition after shearing and kneading, pulling the brace for cooling, granulation, drying and homogenization before packaging.