• 专利标题:   Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.
  • 专利号:   JP6988023-B1, WO2022049902-A1, TW202210572-A, JP2021561032-X, CN115362547-A, EP4113592-A1, US2023097362-A1
  • 发明人:   KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K
  • 专利权人:   FUJI POLYMER IND CO LTD, FUJI POLYMER IND CO LTD, FUJI POLYMER IND CO LTD
  • 国际专利分类:   C08K003/013, C08K003/014, C08K009/06, C08L083/04, C09K005/14, H01L023/36
  • 专利详细信息:   JP6988023-B1 05 Jan 2022 H01L-023/36 202218 Pages: 15 Japanese
  • 申请详细信息:   JP6988023-B1 JP561032 15 Jul 2021
  • 优先权号:   JP148459, JP561032, WOJP026567, CN80025220

▎ 摘  要

NOVELTY - A heat-conductive silicone heat radiation material comprises a silicone polymer which is a matrix resin, a heat-conductive inorganic filler, and a heat-resistance improver. The thermally conductive inorganic filler has specific surface area (ABET) of greater than or equal to 0.3 m2/g and is surface-treated by surface treating agent, and heat-conductive inorganic filler having ABET of less than or equal to 0.3 m2/g. The amount of heat-conductive inorganic filler is 100-10000 mass parts with respect to 100 mass parts silicone polymer of the matrix resin. USE - A heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electric/electronic component and heat sink. ADVANTAGE - Heat resistance and thermal conductivity can be improved. DETAILED DESCRIPTION - A heat-conductive silicone heat radiation material comprises a silicone polymer which is a matrix resin, a heat-conductive inorganic filler, and a heat-resistance improver. The thermally conductive inorganic filler has specific surface area (ABET) of greater than or equal to 0.3 m2/g and is surface-treated by surface treating agent including Si(OR')4 or RxSi(OR')4x, and heat-conductive inorganic filler having ABET of less than or equal to 0.3 m2/g. The amount of heat-conductive inorganic filler is 100-10000 mass parts with respect to 100 mass parts silicone polymer of the matrix resin. R=1-4C hydrocarbon group or 6-12C aromatic hydrocarbon group; R'=1-4C hydrocarbon group; and x=1-2.