• 专利标题:   Packaging film used in packaging structure of photoelectric device, comprises basic unit or stacked basic unit comprising inorganic sequentially of laminated set, nano-structure array and organic layer.
  • 专利号:   WO2022257440-A1, CN115458699-A
  • 发明人:   WANG J, YANG Y
  • 专利权人:   TCL TECHNOLOGY GROUP CORP, TCL TECHNOLOGY GROUP CORP
  • 国际专利分类:   H01L031/0203, H01L031/048, H01L051/44, H01L051/52
  • 专利详细信息:   WO2022257440-A1 15 Dec 2022 H01L-051/52 202302 Pages: 29 Chinese
  • 申请详细信息:   WO2022257440-A1 WOCN143369 30 Dec 2021
  • 优先权号:   CN10636706

▎ 摘  要

NOVELTY - The film (100) has a basic unit (10) or multiple basic units arranged in a stack. The basic unit includes an inorganic layer (1), a nanostructure array (2) and an organic layer (3) stacked in sequence. The nanostructure array is arranged on the surface of the inorganic layer adjacent to the organic layer, and the nanostructure array is completely or partially covered in the organic layer. The material of the inorganic layer is at least one selected from oxides and nitrides. USE - Packaging film for packaging structure (claimed) of photoelectric device such as solar battery, photoelectric detector, organic LED (OLED) device and quantum dot LED (QLED) device. ADVANTAGE - The bonding strength of the inorganic layer and the organic layer of the packaging film is improved. The photoelectric device in the actual application has a higher packaging requirement, such as OLED device needs satisfy water vapor permeability and oxygen permeation is less than or 10-6g/m 2 /day 10-5cc/m2 /day atm, so as to ensure the device has a longer service life. The first packaging technology effectively reduces the corrosion of the water vapor to the photoelectric devices, but the water-oxygen permeability of the sealing glue is high, when the desiccant water absorption reaches saturation, water vapor can enter the photosensitive device. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: a packaging structure of photoelectric device; and a packaging method of photoelectric device. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a packaging film. 1Inorganic layer 2Nanostructure array 3Organic layer 10Basic unit 100Packaging film