• 专利标题:   Nanofield material composition used to prepare thermal interface which is used in field of LEDs, electronic devices, and heat sinks and heat pipes comprises carbon precursor, charge-conducting particles, polymer base, and additives.
  • 专利号:   WO2023108248-A1
  • 发明人:   NISTA S V G, MENDES L G, MOSHKALEV S, SAVU R
  • 专利权人:   UNICAMP UNIV ESTADUAL CAMPINAS, ANDERE E SOUZA FIBRAS PLASTICAS EIRELI
  • 国际专利分类:   B82Y040/00, C08K003/04, C08K003/22, C08L033/08, C08L043/04, H01B001/04
  • 专利详细信息:   WO2023108248-A1 22 Jun 2023 C08L-033/08 202353 Pages: 71
  • 申请详细信息:   WO2023108248-A1 WOBR050509 17 Dec 2022
  • 优先权号:   BR10025585

▎ 摘  要

NOVELTY - Nanofield material composition comprises: 2-79 wt.%, preferably 8 wt.% carbon precursor having graphite, expanded graphite (preferred), graphene, multilayer graphene or carbon nanoribbon; 0.1-35 wt.%, preferably 3.2 wt.% charge-conducting particle having metal oxide, microstructured ceramic, or nanostructured ceramic, i.e. zinc oxide; 10-90 wt.%, preferably 13 wt.%, polymer base having thermopolymerizable acrylic, self-polymerizable acrylic, thermoactivated acrylic, photo-activated acrylic, microwave energy activated acrylic, styrene acrylic, or silicone resins, hot vulcanized silicone, cold vulcanized silicone, or liquid rubbers, high temperature resistant silicone resin, one-component epoxy, two-component epoxy, or fluorinated resins, biopolymer, water-soluble polymer or polymer soluble in organic solvent; and optionally at least one additive having rheological modifier, dispersant, coalescing, antifoaming, bactericidal, catalyst, corrosion inhibitor, organic and/or aqueous solvent. USE - The composition is useful for preparing thermal interface (claimed), which is used in the field of LEDs, electronic devices and devices that require efficient heat sinks e.g. heat sinks and heat pipes. ADVANTAGE - The composition: provides thermal interface created from the application of slurry with a viscosity of less than 100000 cP, paste with an average viscosity of 10000 cP on a surface, and the deposition and/or bonding of a film with a thickness of 0.1-5 mm, preferably 0.5 mm (all claimed), with good heat dissipation performance, to conform to uneven surfaces, expelling air in the contact areas, and improves the thermal conductivity; and utilizes polymeric matrices, in relation to pure graphitic films are the ease handling and preparation of the material, with high mechanical resistance, greater flexibility and durability, and consequent reduction of production cost. DETAILED DESCRIPTION - INDEPENDENT CLAIMs are also included for: obtaining the compositional material comprising (a) preparing a first phase starting from a rheological agent comprising hydroxymethylcellulose, carboxymethylcellulose, ethylcellulose, organic derivative of hectorite clay, associative acrylic thickener hydrophobic alkali-swellable emulsion, and/or aqueous emulsion of acrylic copolymer with a solvent, (b) preparing a second phase from a polymer base, a solvent, a filler particle and/or additive, (c) preparing a third phase by dispersing the carbonic material in solvent or resin by mechanical agitation and/or sonication for at least 10 minutes, with rotation of 70-300 revolutions per minute, (d) adding the first phase to the second phase with the aid of mechanical agitation for at least 10 minutes, with rotation of 70-300 revolutions per minute, (e) adding the third phase in the hybrid phase obtained by adding the first phase to the second phase, by mechanical agitation and/or sonication for at least 10 minutes, with rotation of 70-300 revolutions per minute, and (f) optionally adding the filler particles under mechanical agitation for at least 10 minutes, with rotation of 70-300 revolutions per minute; and forming films, comprising (1) applying the fluid paste on non-stick substrate with thickness control in the application, in which the thickness is of 0.1-5 mm, preferably 0.5 mm, (2) drying and/or curing, (3) mechanical separating the film from the substrate, preferably by detachment at room temperature, and (4) cutting the material to the desired dimensions.