▎ 摘　　要

NOVELTY - The structure (1) has a first thermal conductive layer that is positioned between the metal microstructure and the bottom surface (B) and/or the top surface (T). A second heat-conducting layer is arranged on a side of the metal microstructure away from the first heat-conducting layer. A working fluid (15) is arranged in the enclosed cavity (111) of the heat conduction unit (11). The first heat conduction layer, the metal microstructure, and the second heat conduction layer form a stacked structure (S). The stacked structure is divided into two sections, in the direction along the long axis of the heat conducting unit. The two sections is arranged with a first section (S1) and a second section (S2). The first heat conduction layer and the second heat conduction layer in the first section. The materials of the first heat conduction layer and the second heat conduction layer in the second section are different. USE - Heat conduction structure used in mobile device (claimed). ADVANTAGE - The third heat conduction layer is arranged on the side of the second heat conduction layer away from the metal microstructure to increasing the heat conduction efficiency of the heat conduction structure. The third heat conduction layer improves the coverage and hydrophilicity, and improves the protection of the metal microstructure to avoid corrosion or oxidation. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of manufacturing a heat conduction structure. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the heat conduction structure. Heat conduction structure (1) Heat conduction unit (11) Working fluid (15) Enclosed cavity (111) Bottom surface (B) Stacked structure (S) First section (S1) Second section (S2) Top surface (T)