1. 平台首页
  2. 国际专利信息
  • 专利标题:   Microelectronic assembly comprises interposer, including dielectric material, comprising first liner material at first surface, second liner material at opposing second surface, and perimeter wall through dielectric material.
  • 专利号:   US2022189861-A1, WO2022132274-A1, TW202234610-A, NL2029722-B1
  • 发明人:   EID F, SWAN J M, LIFF S M, ELSHERBINI A A, KABIR M E, ALEKSOV A
  • 专利权人:   INTEL CORP, INTEL CORP, INTEL CORP
  • 国际专利分类:   H01L023/00, H01L023/498, H01L023/538, H01L023/29, H01L023/522, H01L025/16, H01L023/28, H01L023/48, H01L021/56, H01L021/683, H01L023/31, H01L025/00, H01L025/065
  • 专利详细信息:   US2022189861-A1 16 Jun 2022 H01L-023/498 202254 English
  • 申请详细信息:   US2022189861-A1 US121093 14 Dec 2020
  • 优先权号:   US121093

▎ 摘　　要

NOVELTY - Microelectronic assembly comprises an interposer, including dielectric material, comprising a first liner material at a first surface, a second liner material at an opposing second surface, and a perimeter wall through the dielectric material and connected to the first and second liner materials, and a microelectronic component coupled to the second surface of the interposer by a direct bonding region. USE - Microelectronic assembly ADVANTAGE - The microelectronic assembly improves materials and structures to reduce moisture ingress and increase reliability.