▎ 摘　　要

NOVELTY - The method involves providing a thin film of solid materials onto a substrate. The substrate is deformable by heat and indentation. The thermo-mechanical indentation of thin film of solid materials is performed. The deformable substrate is thermally deformed and patterned by indentation the thin film of solid materials thus obtaining patterning features on the thin film of solid materials. The thermo-mechanical indentation step is performed by a heated indentation probe or stamp. The thermo-mechanical indentation step is performed by thermal scanning probe lithography or thermal nanoimprint lithography. The thin film of solid materials is a two-dimensional (2D) layer of solid material. The thin film of solid material is linked to the below deformable substrate by van der Waals interactions. The substrate deformable by heat and indentation is thermoplastic materials or elastomeric materials. USE - Method for patterning thin film of solid materials such as covalent network solid. ADVANTAGE - The method is versatile, rapid and cost-effective method for patterning a few nanometers thick layer of (a) solid material(s), such as a covalent network solid, including graphene and transition metal dichalcogenides such as molybdenum ditelluride. The method for the direct nanocutting of 2D materials for precisely tailoring nanostructures with foreseen applications in the fabrication of electronic and photonic nanodevices is provided. The strain nanopatterning is provided to manipulate the local bandgap of two-dimensional (2D) materials with nanometer-scale resolution for ultrathin semiconductor applications. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) an article of manufacture for patterning thin film of solid materials; and (2) a device for patterning thin film of solid materials. DESCRIPTION OF DRAWING(S) - The drawing shows the schematic diagram of thermo-mechanical indentation technique for 2D materials and fabrication results.