▎ 摘　　要

NOVELTY - A benzoxazine compound (I), is new. USE - New benzoxazine compound used in composition (claimed) for resin e.g. phenolic resin and reinforcing material for high-performance composite material, electronic insulating material, and electronic packaging material. ADVANTAGE - The compound (I) has excellent toughness after curing, reduced dielectric constant and reduced dielectric loss, and effectively reduces the brittleness of the cured benzoxazine material. DETAILED DESCRIPTION - A benzoxazine compound of formula (I), is new. R1 = group of formula (a); R1'-R8' = H, OH, or F; R2 = -(CH2)n-, -C6H4-, -NHCO-, -CONH, -COO-, -OCO-, or -S-; n = 1-4; R3 = -(CH2)n'-; n' = 4-15;and R4,R5 = -H, -CH3, -C2H5, -C(CH3)3, or -C(CF3)3. INDEPENDENT CLAIMS are included for the following: (1) a composition, which comprises the compound (I), and further comprises functional fillers, and fibers; and (2) preparation of the compound (I).