▎ 摘　　要

NOVELTY - Prepreg comprises a reinforcing material, and a thermosetting resin composition attached to the reinforcing material by dipping and drying. The thermosetting resin composition comprises thermosetting resin and inorganic filler. The inorganic filler is coated with graphene oxide and molybdenum disulfide nanosheet. The total amount of graphene oxide and molybdenum disulfide nanosheet is 1-2 wt.%. The graphene oxide has a thickness of not more than 10 nm. USE - Prepreg is useful in a laminate for a printed circuit board (all claimed), where the laminate is a copper clad laminate. ADVANTAGE - The prepreg improves comprehensive performance, surface resistivity and light shielding property of the printed circuit board.