• 专利标题:   Ultra-violet adhesive film used for semiconductor dicing comprises substrate and ultra-violet adhesive layer, where the ultra-violet adhesive layer comprises modified graphene, butyl acetate, acrylic acid, trimethylolpropane triacrylate, hydroxyethyl acrylate, photoinitiator and N-methylpyrrolidone.
  • 专利号:   CN115678446-A
  • 发明人:   ZHANG H
  • 专利权人:   HUNAN YOUDUO NEW MATERIAL TECHNOLOGY CO
  • 国际专利分类:   C09J011/04, C09J004/02, C09J007/25, C09J007/30
  • 专利详细信息:   CN115678446-A 03 Feb 2023 C09J-007/25 202319 Chinese
  • 申请详细信息:   CN115678446-A CN11251014 13 Oct 2022
  • 优先权号:   CN11251014

▎ 摘  要

NOVELTY - Ultra-violet adhesive film comprises substrate and ultra-violet adhesive layer, where the ultra-violet adhesive layer comprises 3-5 pts. wt. modified graphene, 50-60 pts. wt. butyl acetate, 4-7 pts. wt. acrylic acid, 5-10 pts. wt. trimethylolpropane triacrylate, 2-4 pts. wt. hydroxyethyl acrylate, 0.4-0.6 pts. wt. photoinitiator and 20-30 pts. wt. N-methylpyrrolidone. USE - The ultra-violet adhesive film is used for semiconductor dicing. ADVANTAGE - The adhesive film has good bonding strength before UV curing, and the viscous reducing effect is remarkable after UV curing, and after viscosifying, there is no residual glue on the surface separated from objects. DETAILED DESCRIPTION - Ultra-violet adhesive film comprises substrate and ultra-violet adhesive layer, where the ultra-violet adhesive layer comprises 3-5 pts. wt. modified graphene, 50-60 pts. wt. butyl acetate, 4-7 pts. wt. acrylic acid, 5-10 pts. wt. trimethylolpropane triacrylate, 2-4 pts. wt. hydroxyethyl acrylate, 0.4-0.6 pts. wt. photoinitiator and 20-30 pts. wt. N-methylpyrrolidone, the preparation of modified graphene includes (i) mixing phosphoric acid and triethylamine evenly to form mixture at mass ratio of 10:5-6, keep the temperature of the mixture at 70±5°C in water bath and keep it warm for 3-4 hours, after the heat preservation is over, adding graphene oxide to the mixture at solid/liquid ratio of 1:20, stirring the mixture at constant temperature of 70±5°C for 1-2 hours, then separate the solid from the liquid, washing the solid phase with ethanol, and drying it to obtain solid phase A, (ii) configuring aqueous solution of 2-acrylamido 2-methylpropanesulfonic acid, where the concentration of 2-acrylamido 2-methylpropanesulfonic acid is 10-15 g/300 ml, the solid-liquid mass ratio of solid phase A is solid phase A/2-acrylamido 2-methylpropanesulfonic acid aqueous solution=1/50, stirring the solution, and adding solid phase A to the aqueous solution of 2-acrylamido 2-methylpropanesulfonic acid during the stirring process, continue to stir for 10-20 minutes after the addition is complete, and then add acrylamide to the solution under stirring, continue to stir for 5-8 minutes after the feeding is completed, then keep the water bath at a constant temperature to 70±5°C, where mass ratio of the added mass of the acrylamide to the solid phase A is acrylamide:solid phase A=2-3:1, adding dibenzoyl peroxide to the solution under stirring after constant temperature, the mass ratio of the added mass of the dibenzoyl peroxide to the solid phase A is dibenzoyl peroxide:solid phase A=0.03 mg:10-16 g, stir at a constant temperature of 70±5°C for 5-7 hours after the addition is completed, then stop stirring, air-cooling to normal temperature, separate solid and liquid, washing the solid phase with deionized water, and drying to obtain solid phase boron, (iii) mixing succinic anhydride, hydrogen peroxide and water at mass ratio of 1-1.5:0.8-1.2:2, stir at 8-10°C for more than 4 hours to obtain mixture modifier, dispersing the solid phase B in N,N'-dimethylformamide to form suspension, where mass fraction of solute in the hydrogen peroxide is 30%, the solid-to-liquid ratio of the solid phase B dispersed in N,N'-dimethylformamide solid phase B/N,N'-dimethylformamide=1-2 g/400 ml, keep the temperature of the suspension in a water bath to 80±5°C, stirring the suspension under heat preservation conditions, adding mixture modifier under the stirring state, where addition amount of the mixture modifier is 3-4 times the mass of the solid phase boron, continue to stir at constant temperature for more than 60 hours after the addition is completed, then air-cooling to normal temperature, separating the solid and liquid, washing the solid phase twice with ethanol, then washing twice with deionized water, and drying to obtain modified graphene; the ultra-violet adhesive film preparation comprises weighing each ultra-violet adhesive layer raw material, mixing butyl acetate, acrylic acid, trimethylolpropane triacrylate, and hydroxyethyl acrylate evenly to obtain mixed component 1, dispersing the modified graphene in N-methylpyrrolidone to obtain mixed component 2, heating the mixed component 1 to temperature range of 60±2°C, keep it warm and stir, and add the mixed component 2 first under the stirring state, continue stirring for 20-30 minutes after the feeding is completed, then add the photoinitiator, continue stirring for 10-20 minutes after the feeding is completed, then, it is coated on the surface of the substrate, and dried at 120°C for 2-3 minutes to obtain the UV adhesion-reducing film.