▎ 摘　　要

NOVELTY - Component carrier (100) comprises stacking member (102) provided with one electrically conductive layer structure (104) and one electrically insulating layer structure (106). A component (108) is located on stacking member, and one continuous vertical through connecting portion (110) extends between two opposite main surfaces of component and extends straight through component and continuing to extend directly through one further structure (112) of component carrier. USE - Component carrier i.e. printed circuit board. ADVANTAGE - The integrated density of the component carrier is improved by forming the continuous vertical through connecting portion between the main surfaces of the laminated component and/or laminated piece. The component carrier has high reliability and high integrated density. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing component carrier, which involves: (a) forming stacking member; (b) assembling component on the layer stack or in the layer stack; and (c) forming one continuous vertical through-connection, where one continuous vertical through-connection extending between two opposite main surfaces of component and extending straight through the component and continuing straight through one further structure of component carrier. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a component carrier having a laminated laminate, where component carrier has three stacked embedded components having a common continuous vertical through connection portion. Component carrier (100) Stacking member (102) Electrically conductive layer structure (104) Electrically insulating layer structure (106) Component (108) Continuous vertical through connecting portion (110) Further structure (112)