▎ 摘　　要

NOVELTY - The method involves providing a metal block (20). The metal block is provided with multiple heat conducting holes (21). The heat conducting holes are passed through opposite two surfaces of the metal block. A graphene layer (30) is arranged on an outer surface of an aluminum block and an inner side wall of the heat-conducting hole to obtain a heat-radiating block (200). USE - Method for manufacturing a radiating block of a circuit board (all claimed). ADVANTAGE - The radiating block is provided with multiple heat conducting holes, so as to reduce the self weight of the radiating blocks, which is good for reducing the falling risk caused by overlarge self weight. The heat conducting effect of the graphene layer is improved, and the heat conducting effects of the metal block are improved. The self-weighting effect is improved and the fall risk caused due to the large self weight is reduced. The graphene layer improves the heat conductivity and the thermal conductivity, so that the heat dissipation effect is increased. The thermal resistance is reduced and the reliability of the circuit board is improved by reducing the thermal resistance between the inner circuit unit, the outer circuit unit and the dielectric layer of the inner and outer circuit units. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: a radiating block; and a method for manufacturing a circuit board; a circuit board. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic perspective sectional view of a radiating block. 20Metal block 21Heat conducting hole 30Graphene layer 200Radiating block