▎ 摘　　要

NOVELTY - Addition-type organic silicon heat-conducting adhesive masterbatch comprises 5000 pts. wt. organic silicon monomer I, 0-500 pts. wt. organic silicon monomer II, 10-50 pts. wt. blocking agent, 5-20 pts. wt. catalyst I and 500- 5000 pts. wt. high heat-conducting filler. USE - Used as addition-type organic silicon heat-conducting adhesive masterbatch. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: preparing addition-type silicone heat-conducting adhesive masterbatch comprising (1) drying of high thermal conductivity filler, (2) vacuum dehydration of the monomer by adding the weighed organosilicon monomer I, organosilicon monomer II, and end-capping agent into the reaction vessel, stir evenly, and vacuumize after heating up, (3) mixing by removing the vacuum, adding the high thermal conductivity filler dried in step (1), and mix and stir for 30-60 minutes under the protection of nitrogen, (4) ring-opening polymerization by adding catalyst I, slowly raising the temperature until the ring-opening polymerization reaction is triggered, and fully react for a period of time at this ring-opening temperature, (5) carrying out heat preservation reaction by continue to heat up to 100-150°C, heat preservation reaction for 1-4 hours, (6) removing low boiling matter by heating up to 180-190°C, vacuumizing until no liquid drips out from the condensation port, (7) output is the addition type silicone heat-conducting adhesive masterbatch; and masterbatch is the addition-type silicone heat-conducting adhesive masterbatch; and preparing an addition-type silicone thermally conductive adhesive comprising (1) preparing addition-type organosilicon heat-conducting adhesive masterbatch, (2) according to the prescription preparation component A and component B, and (3) mixing component A and component B evenly, and vacuumizing and defoaming to prepare the addition-type silicone heat-conducting adhesive.