• 专利标题:   Preparing graphene/copper composite material useful in field of heat conduction, comprises e.g. preparing deposition solution, polishing anode and cathode plate, removing oil stain, carrying out alternate electrodeposition and performing asynchronous rolling and recrystallization annealing.
  • 专利号:   CN115418200-A
  • 发明人:   LIU X, WANG D, AN X, WEI K, XIA C, WEI W
  • 专利权人:   UNIV CHANGZHOU
  • 国际专利分类:   C09K005/14, C25D015/00
  • 专利详细信息:   CN115418200-A 02 Dec 2022 C09K-005/14 202311 Chinese
  • 申请详细信息:   CN115418200-A CN11070041 02 Sep 2022
  • 优先权号:   CN11070041

▎ 摘  要

NOVELTY - Preparing graphene/copper composite material comprises (i) preparing graphene/copper composite deposition solution using 2-mercaptobenzimidazole, chlorine ions and janus green (JGB) as additives, (ii) using metallographic sandpaper to polish anode copper plate and cathode titanium plate, removing oil stains and oxide films, and activating plates with 10% dilute hydrochloric acid solution for 5-20 minutes, (iii) carrying out alternate electrodeposition in deposition solution by pulse electrodeposition method, i.e. firstly depositing in deposition solution containing 2-mercaptobenzimidazole and chlorine ions for 10 minutes, then depositing for 10 minutes in deposition solution containing janus green, cycling twice, and depositing for 40 minutes altogether to obtain high-intensity high-thermal-conductivity graphene/copper composite coating, and (iv) performing asynchronous rolling and recrystallization annealing on electrodeposited coating. USE - The method is useful for preparing graphene/copper composite material in field of heat conduction (claimed). ADVANTAGE - The material: has high strength, high thermal conductivity, low roughness, 298-524 MPa tensile strength, 280-1180 W/m.k thermal conductivity, and 0.3±0.1 to 3±0.1 μm roughness, which can improve heat dissipation efficacy and meet requirements in field of heat conduction.