• 专利标题:   Aluminium graphene uniform temperature plate for flat computer internal heat dissipation, has graphene layer arranged between aluminum-based upper plate and aluminum-based lower plate, and cross-linking holes provided with aluminum-based connecting particles.
  • 专利号:   CN115328285-A
  • 发明人:   WANG G, XU X
  • 专利权人:   ANHUI HANXI TECHNOLOGY CO LTD
  • 国际专利分类:   B23P015/26, C01B032/184, F28F021/02, F28F021/08, F28F003/00, G06F001/20
  • 专利详细信息:   CN115328285-A 11 Nov 2022 G06F-001/20 202306 Chinese
  • 申请详细信息:   CN115328285-A CN10962072 11 Aug 2022
  • 优先权号:   CN10962072

▎ 摘  要

NOVELTY - The plate has a graphene layer (3) arranged between an aluminum-based upper plate (1) and an aluminum-based lower plate (2). The graphene layer is evenly distributed with multiple cross-linking holes (4). The cross-linking holes are provided with aluminum-based connecting particles (5). USE - Aluminium graphene uniform temperature plate for flat computer internal heat dissipation. ADVANTAGE - The composite cooling plate has excellent heat dissipation effect, and leads in the field of low power consumption, and has a remarkable effect in the field of high power consumption, and has low density, with a certain degree of flexibility, and adopts for a variety of curved occasions, and the service life is longer, and realizes the ultra-high lateral thermal conductivity, greatly improves longitudinal heat conduction efficiency (from 20W/(m-K) to 312.8W/(m-K). The plate has a very high heat capacity of metal heat-conducting materials, which significantly improves the overall heat dissipation effect of the material, and makes up for the shortcomings of graphene-based materials that are not ideal for high power consumption heat dissipation. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for manufacturing an aluminium graphene uniform temperature plate. DESCRIPTION OF DRAWING(S) - The drawing shows an exploded perspective view of an aluminium graphene uniform temperature plate for flat computer internal heat dissipation. 1Aluminium-based upper plate 2Aluminium base lower plate 3Graphene layer 4Cross-linking hole 5Aluminium-based connecting particle