▎ 摘　　要

NOVELTY - Film comprises a metal film layer, a conductive pressure sensitive tape (3), a phase change thermal conductive adhesive (1), and an insulating tape (2). The conductive pressure-sensitive adhesive tape includes pressure-sensitive adhesive, conductive cloth, conductive filler powder, cross-linking additive, leveling agent, anti-settling agent, and dilution solvent. The phase change thermal conductive adhesive includes paraffin wax, polymer material, thermal conductive filler powder, coupling agent, and the dilution solvent. USE - Film used for chip shielding and heat conduction. ADVANTAGE - The film is lighter and thinner, and has excellent thermal conductivity and has a shielding function. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing a film, which involves: (A) mixing paraffin wax, polymer material, thermal conductive filler powder, coupling agent, and diluent solvent, stirring to obtain phase change thermal conductive adhesive; (B) coating the phase change thermal conductive adhesive on the center of the metal film layer, where coating size of the phase change thermally conductive adhesive is that the metal thin film is reduced in proportion, and the ratio of the phase change thermally conductive adhesive to the metal thin film ranges from 1:3-1:2; (C) punching insulating tape into a scaled-down size of the metal film, and the ratio of the insulating tape to the metal film is in the range of 22:30-29:30; (D) punching out a hole in the center of the insulating tape that is compatible with the phase change thermally conductive adhesive, and position and transfer the insulating tape to the corresponding position of the metal film layer; (E) mixing and stirring the pressure-sensitive adhesive, conductive filler powder, crosslinking aid, leveling agent, anti-settling agent, and the diluent solvent, obtaining a conductive paste, use a vertical coater to coat the conductive paste on both sides of the conductive cloth, and dry through a drying tunnel to obtain a conductive pressure sensitive adhesive tape; (F) die-cutting the size of the conductive pressure sensitive tape into the size of the metal film, center of the conductive pressure sensitive tape is punched into a hole that matches the insulating tape; and (G) positioning the conductive pressure sensitive tape and transferring to the corresponding position of the metal thin film layer to obtain a thin film. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of film. Phase change thermal conductive adhesive (1) Insulating tape (2) Conductive pressure sensitive tape (3)