▎ 摘　　要

NOVELTY - Halogen-free low-dielectric epoxy resin composition comprises 5-15 pts. wt. dicyclopentadiene epoxy resin, 25-35 pts. wt. cresol novolac epoxy resin, 55-65 pts. wt. maleimide resin, 20-30 pts. wt. 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide (DOPO)-bisphenol phenolic resin hardener, 65-75 pts. wt. cyanate resin, 5-15 pts. wt. crosslinking agent, 35-45 pts. wt. non-DOPO flame retardant, and 1-5 pts. wt. toughening agent, where the toughening agent is a core-shell polymer comprising an intermediate layer containing 30-100 wt.% multifunctional monomers and 0-70 wt.% vinyl monomers, and the shell part of the core-shell polymer comprises epoxy monomers. USE - The halogen-free low-dielectric epoxy resin composition is useful in laminated plate and printed circuit board e.g. high-frequency printed circuit boards. ADVANTAGE - The halogen-free low-dielectric epoxy resin composition has good thermal resistance and toughness, and has low dielectric index. The laminated plate formed using the composition has improved has good thermal resistance and toughness. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: laminated board, comprising a resin substrate provided with multiple prepreg films, each of the prepreg films is composed of a glass fiber cloth by coating the halogen-free and low-dielectric epoxy resin composition, and a metal foil layer disposed on at least one surface of the resin substrate; and printed circuit board.