▎ 摘　　要

NOVELTY - A high-thermal conductivity organic silicone adhesive comprises 60-80 pts. wt. dihydroxy polydimethylsiloxane, 10-30 pts. wt. epoxy group-containing siloxane, 15-25 pts. wt. crosslinking agent and 5-10 pts. wt. modified graphene oxide. The modified graphene oxide is graphene oxide modified with surface modifier. USE - Organic silicone adhesive is used for preparing thermally conductive phase change material for improving heat dissipation performance of component (all claimed). ADVANTAGE - The organic silicone adhesive has excellent bonding performance and thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included method for improving heat dissipation performance of component, which involves fixing component using the high-thermal conductivity organic silicone adhesive.